HP | HPQ - 贷款资金





贷款资金 更改 日
3D Systems USD 87.24M 454K 2026-06
Accenture USD 10B 4.97B 2026-06
Advanced Micro Devices USD 2.35B 1000K 2026-06
Amphenol USD 17.18B 537.7M 2026-06
Apple USD 71.34B 3.06B 2026-06
Applied Materials USD 5.24B 11M 2026-06
Broadcom USD 57.17B 5.49B 2026-06
Canon JPY 404.32B 76M 2026-06
CDW USD 4.81B 173M 2026-06
Ciena USD 3.23B 1.71B 2026-06
Cisco Systems USD 19.37B 1000K 2026-06
CommScope USD 7.26B 1.98B 2025-12
Corning USD 7.76B 38M 2026-06
F5 Networks USD 0 0 2024-12
Hewlett Packard USD 17.34B 894M 2026-06
HP USD 7.87B 988M 2026-06
IBM USD 56.21B 1.49B 2026-06
Intel USD 48.55B 5.52B 2026-06
Jabil Circuit USD 2.88B 1000K 2026-06
KLA Corporation USD 5.89B 352K 2026-06
Lam Research USD 3.73B 106K 2026-06
Lenovo USD 5.67B 1.81B 2026-06
Micron Technology USD 4.69B 1.64B 2026-09
Microsoft USD 31.07B 356M 2026-06
Motorola Solutions Msi USD 8.42B 2M 2026-06
NCR USD 1.1B 1000K 2026-06
NetApp USD 1.94B 549M 2026-06
Nvidia USD 32.37B 24.9B 2026-06
Oracle USD 117.71B 4.63B 2026-06
Qualcomm USD 12.78B 1.99B 2026-06
Ricoh JPY 348.24B 12.06B 2026-06
Sanmina USD 1.96B 42.45M 2026-06
Seagate Technology USD 3.38B 85M 2026-06
Seiko Epson JPY 165.75B 2.38B 2026-06
Sensata Technologies USD 2.42B 404.6M 2026-06
SYNNEX USD 3.6B 1.17M 2026-06
TE Connectivity USD 5.53B 23M 2026-06
Western Digital USD 2.43B 28M 2025-12
Xerox USD 3.48B 785M 2025-06