HP | HPQ - 贷款资金





贷款资金 更改 日
3D Systems USD 86.79M 9.12M 2026-03
Accenture USD 5.03B 873K 2026-03
Advanced Micro Devices USD 2.35B 2M 2026-03
Amphenol USD 16.64B 2.07B 2026-03
Apple USD 74.4B 2.28B 2026-03
Applied Materials USD 5.26B 1.2B 2026-03
Broadcom USD 62.66B 1.15B 2026-03
Canon JPY 304.97B 247M 2025-12
CDW USD 4.64B 12.8M 2026-03
Ciena USD 1.52B 5.2M 2026-03
Cisco Systems USD 19.37B 2B 2026-03
CommScope USD 7.26B 1.98B 2025-12
Corning USD 7.72B 88M 2026-03
F5 Networks USD 0 0 2024-12
Hewlett Packard USD 18.24B 532M 2026-03
HP USD 8.86B 18M 2026-03
IBM USD 57.71B 2.87B 2026-03
Intel USD 43.03B 1.06B 2026-03
Jabil Circuit USD 2.88B 497M 2026-03
KLA Corporation USD 5.89B 935K 2026-03
Lam Research USD 3.73B 162K 2025-12
Lenovo USD 3.86B 566.95M 2026-03
Micron Technology USD 3.05B 6.51B 2026-03
Microsoft USD 31.42B 4B 2026-03
Motorola Solutions Msi USD 8.42B 2M 2026-03
NCR USD 1.1B 0 2026-03
NetApp USD 2.49B 1000K 2026-03
Nvidia USD 7.47B 1000K 2026-03
Oracle USD 122.34B 8.09B 2026-03
Qualcomm USD 14.77B 45M 2026-03
Ricoh JPY 360.31B 3.77B 2026-03
Sanmina USD 2B 1.16M 2026-03
Seagate Technology USD 3.47B 36M 2026-03
Seiko Epson JPY 163.37B 5.55B 2026-03
Sensata Technologies USD 2.83B 18.1M 2026-03
SYNNEX USD 3.59B 1.16M 2026-03
TE Connectivity USD 5.55B 697M 2026-03
Western Digital USD 2.43B 28M 2025-12
Xerox USD 3.48B 785M 2025-06