Methode Electronics | MEI - 贷款资金





贷款资金 更改 日
Aac Technologies CNY 7.6B 2.22B 2024-12
Amphenol USD 16.64B 2.07B 2026-03
Applied Optoelectronics USD 129.83M 291K 2025-12
Bel Fuse USD 204.5M 7M 2026-03
Benchmark Electronics USD 206.83M 5.8M 2025-12
Cognex USD 0 0 2025-03
CTS USD 62.5M 5M 2026-03
Daktronics USD 74.47M 21.31M 2024-07
Dolby Laboratories USD 0 0 2025-03
Enerpac Tool Group USD 177.25M 2.46M 2025-12
Fingerprint Cards SEK 900K 900K 2025-06
IPG Photonics USD 15.73M 297K 2022-03
Jabil Circuit USD 2.88B 497M 2026-03
Knowles USD 131M 17M 2026-03
Littelfuse USD 531.05M 175.34M 2026-03
Methode Electronics USD 340.7M 44.9M 2025-12
Osi Systems USD 998.75M 154K 2026-03
Plexus USD 91.03M 105K 2026-03
Sanmina USD 2B 1.16M 2026-03
TE Connectivity USD 5.55B 697M 2026-03
TTM Technologies USD 911.84M 494K 2026-03